Assignment of Assignors Interest.

Recorded: 1989-08-04 Pages: 2

Assignors

SAITO, YUICHI

Executed: 1989-06-30

SHINSUKE, SAKAI

Executed: 1989-06-30

HAYASHI, HISAO

Executed: 1989-07-03

MATSUSHITA, TAKESHI

Executed: 1989-07-03

Assignees

JAPAN SILICON CO., LTD

8-16, IWAMOTO-CHO, 3-CHOME, CHIYODA-KU, TOKYO, JAPAN

SONY CORPORATION

7-35, KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO, JAPAN

Covered Property (1)

Method for Polishing a Silicon Wafer Using a Ceramic Polishing Surface Having a Maximum Surface Roughness Less Than 0.02 Microns

Patent: 5,096,854 →

Application: 07/367,637 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.