Patent Assignment
Reel/Frame 005381/0665
Assignment of Assignors Interest.
Recorded: 1990-07-26
Pages: 2
Assignee
WATKINS-JOHNSON COMPANY
STANFORD RESEARCH PARK, 3333 HILLVIEW AVENUE, A CORP. OF CA, PALO ALTO, CALIFORNIA, 94304-1204
Covered Property
(1)
Microwave Integrated Circuit Package to Eliminate Alumina Substrate Cracking and Method
Patent:
5,102,029 →
Application:
07/542,724 →
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 13, 1997
From: WATKINS-JOHNSON COMPANY, A CALIFORNIA CORPORATION
To: STELLEX MICROWAVE SYSTEMS, INC., A CALIFORNIA CORPORATION
Reel/Frame 008811/0760 →
Security Interest
Nov 14, 1997
From: STELLEX MICROWAVE SYSTEMS, INC.
To: FIRST UNION COMMERCIAL CORPORATION
Reel/Frame 008829/0085 →
Assignment of Assignor's Interest
Feb 27, 2001
From: STELLEX MICROWAVE SYSTEMS, INC.
To: M/A COM TECH, INC.
Reel/Frame 011551/0401 →
Release
Feb 27, 2001
From: FIRST UNION COMMERCIAL CORPORATION, AS COLLATERAL AGENT
To: STELLEX MICROWAVE SYSTEMS, INC.
Reel/Frame 011855/0294 →
Assignment of Assignor's Interest
Jun 11, 2001
From: M/A COM TECH, INC.
To: TYCO ELECTRONICS LOGISTICS AG
Reel/Frame 011887/0173 →
Assignment of Assignor's Interest
Feb 18, 2009
From: M/A COM, INC.; RAYCHEM INTERNATIONAL; TYCO ELECTRONICS CORPORATION; THE WHITAKER CORPORATION
To: COBHAM DEFENSE ELECTRONIC SYSTEMS CORPORATION
Reel/Frame 022266/0400 →