Assignment of Assignor's Interest

Recorded: 1993-08-02 Pages: 2

Assignor

NISHIKAWA, HIDEYUKI

Executed: 1993-07-29

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Process for Correcting Warped Surface of Plastic Encapsulated Semi- Conductor Device

Patent: 5,492,866 →

Application: 08/100,323 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.