Patent Assignment
Reel/Frame 006710/0870
Assignment of Assignor's Interest
Recorded: 1993-09-22
Pages: 2
Assignor
KIM, GU-SUNG
Executed: 1993-09-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN 3-DONG, KWONSUN-KU, SUWON KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Process for Mounting a Semiconductor Chip and Depositing Contacts into Through Holes of a Circuit Board and of an Insulating Interposer and Onto the Chip
Patent:
5,407,864 →
Application:
08/095,375 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.