Patent Assignment
Reel/Frame 007400/0259
Assignment of Assignor's Interest
Recorded: 1995-03-06
Pages: 2
Assignee
DYCONEX PATENTE AG
C/O HEINZE + CO. BAARERSTRASSE 43, 6300 ZUG, SWITZERLAND
Covered Property
(1)
Method of Manufacturing Multilayer Foil Printed Circuit Boards
Patent:
5,729,897 →
Application:
08/397,106 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
Jul 20, 1998
From: IMMUNIVEST CORPORATION
To: JOHNSTON ASSOCIATES, INC.
Reel/Frame 009479/0640 →
Omnibus Termination to Loan Documents, Termination of Security Agreement
Jun 27, 2003
From: ROBERT JOHNSTON AND LENDERS AND CREDITORS
To: IMMUNIVEST CORPORATION
Reel/Frame 014215/0235 →