Patent Assignment
Reel/Frame 007670/0187
Assignment of Assignor's Interest
Recorded: 1995-09-19
Pages: 2
Assignor
IMAMURA, TAKAFUMI
Executed: 1995-08-30
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Process of Forming Miniature Pattern Well Controlled in Thickness on Semiconductor Wafer Through Selective Electroplating
Patent:
5,679,234 →
Application:
08/530,424 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.