IP Library Assignment 007670/0187
Patent Assignment
Reel/Frame 007670/0187

Assignment of Assignor's Interest

Recorded: 1995-09-19 Pages: 2
Assignor
IMAMURA, TAKAFUMI
Executed: 1995-08-30
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Process of Forming Miniature Pattern Well Controlled in Thickness on Semiconductor Wafer Through Selective Electroplating
Patent: 5,679,234 →
Application: 08/530,424 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 16, 2002
From: NEC CORPORATION
To: NEC COMPOUND SEMICONDUCTOR DEVICES, LTD.
Reel/Frame 013392/0729 →