Assignment of Assignor's Interest

Recorded: 1995-09-19 Pages: 4

Assignors

IZUMI, ATSUHIKO

Executed: 1995-09-11

INABA, TAKEHITO

Executed: 1995-09-11

AZUMA, KOUSUKE

Executed: 1995-09-11

Assignee

NEC CORPORATION

7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Molding Die for Sealing Semiconductor Device with Reduced Resin Burrs

Patent: 5,635,220 →

Application: 08/530,425 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.