Patent Assignment
Reel/Frame 008088/0538
Assignment of Assignor's Interest
Recorded: 1996-08-19
Pages: 2
Assignee
SCP GLOBAL TECHNOLOGIES
400 BENJAMIN LANE, BOISE, IDAHO, 83704
Covered Property
(1)
Wafer Gap Conductivity Cell for Characterizing Process Vessels and Semiconductor Fabrication Processes and Method Od Use
Patent:
5,882,598 →
Application:
08/660,113 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Dec 31, 2001
From: SCP GLOBAL TECHNOLOGIES, A DIVISION OF PRECO, INC.
To: SCP GLOBAL TECHNOLOGIES, INC.
Reel/Frame 012407/0035 →
Security Agreement
Nov 18, 2003
From: SCP U.S., INC.
To: COMERICA BANK, SUCCESSOR BY MERGER TO COMERICA BANK-CALIFORNIA
Reel/Frame 014699/0580 →
Reassignment and Release of Security Interest
Jun 23, 2005
From: COMERICA BANK, SUCCESSOR BY MERGER TO COMERICA BANK-CALIFORNIA
To: SCP U.S., INC.
Reel/Frame 016172/0539 →
Assignment of Assignor's Interest
May 8, 2007
From: SCP GLOBAL TECHNOLOGIES, INC.
To: SCP SERVICES, INC.
Reel/Frame 019260/0476 →
Security Agreement
Dec 26, 2007
From: AKRION SCP ACQUISITION CORP.
To: BHC INTERIM FUNDING II, L.P.
Reel/Frame 020279/0925 →