Patent Assignment
Reel/Frame 008455/0336
Assignment of Assignor's Interest
Recorded: 1997-03-07
Pages: 3
Assignors
SUZUKI, TOSHIHARA
Executed: 1997-02-22
MAEDA, KEIICHI
Executed: 1997-02-28
KOYAMA, KAZUHIDE
Executed: 1997-02-28
ODA, TATSUJI
Executed: 1997-02-28
Assignee
SONY CORPORATION
7-35 KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Making Multilayer Wiring Structure
Patent:
6,043,145 →
Application:
08/813,350 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 16, 2015
From: SONY CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 035430/0231 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →