Patent Assignment
Reel/Frame 008508/0109
Assignment of Assignor's Interest
Recorded: 1997-04-16
Pages: 2
Assignor
PRCHAL, DAVE
Executed: 1997-04-09
Assignee
SONY CORPORATION
7-35, KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property
(1)
Method for Connecting Two Substrates in a Thick Film Hybrid Circuit
Patent:
5,825,631 →
Application:
08/839,880 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
(Assignment of Assignor's Interest) Re-Record to Correct the Number of Microfilm Pages from 2 to 3. an Assignment Was Previously Recorded at Reel 8508, Frame 0109.
Apr 16, 1997
From: PRCHAL, DAVE
To: SONY CORPORATION
Reel/Frame 008614/0118 →
Security Agreement
Feb 26, 1999
From: STARKEY LABORATORIES, INC.
To: LASALLE NATIONAL BANK, AS AGENT
Reel/Frame 009764/0475 →
Assignment of Assignor's Interest
Jul 23, 2002
From: PRCHAL, DAVE
To: STARKEY LABORATORIES, INC.
Reel/Frame 013108/0645 →