Assignment of Assignor's Interest

Recorded: 1997-05-16 Pages: 5

Assignor

CHO, JAE WON

Executed: 1997-04-29

Assignee

LG SEMICON CO., LTD.

1, HYANGJEONG-DONG, HUNGDUK-GU CHEONGJU, CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF

Covered Property (1)

Substrate for Semiconductor Package, Fabrication Method Thereof, and Stacked-Type Semiconductor Package Using the Substrate

Patent: 6,153,928 →

Application: 08/857,462 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.