IP Library Assignment 009369/0427
Patent Assignment
Reel/Frame 009369/0427

Assignment of Assignor's Interest

Recorded: 1998-08-04 Pages: 2
Assignor
RHA, SA KYUN
Executed: 1998-07-08
Assignee
LG SEMICON CO., LTD.
1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU, CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Property (1)
Manufacturing Method of Interconnection Layer for Semiconductor Device
Patent: 6,294,462 →
Application: 09/129,000 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jul 11, 2000
From: LG SEMICON CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES, CO., LTD.
Reel/Frame 010951/0606 →