Patent Assignment
Reel/Frame 009369/0427
Assignment of Assignor's Interest
Recorded: 1998-08-04
Pages: 2
Assignor
RHA, SA KYUN
Executed: 1998-07-08
Assignee
LG SEMICON CO., LTD.
1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU, CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Manufacturing Method of Interconnection Layer for Semiconductor Device
Patent:
6,294,462 →
Application:
09/129,000 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.