IP Library Assignment 009457/0739
Patent Assignment
Reel/Frame 009457/0739

Assignment of Assignor's Interest

Recorded: 1998-09-11 Pages: 3
Assignor
KIM, YOUNG-GON
Executed: 1998-09-05
Assignee
LG SEMICON CO., LTD.
1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU, CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Property (1)
Nozzle Structure of Repair Apparatus for Semiconductor Package
Patent: 6,105,847 →
Application: 09/151,702 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 26, 2000
From: LG SEMICON CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
Reel/Frame 011033/0103 →