IP Library Assignment 009606/0723
Patent Assignment
Reel/Frame 009606/0723

Assignment of Assignor's Interest

Recorded: 1998-11-20 Pages: 2
Assignor
LEE, JU-HWA
Executed: 1998-10-20
Assignee
LG SEMICON CO., LTD.
1, HYANGJEONG-DONG, HEUNGDUK-KU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Property (1)
A Method of Fabricating a Semiconductor Package
Patent: 6,146,918 →
Application: 09/195,996 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jul 11, 2000
From: LG SEMICON CO., LTD.
To: HYUNDAI ELECTRONICS INDUSTRIES, CO., LTD.
Reel/Frame 010951/0606 →