Patent Assignment
Reel/Frame 009606/0723
Assignment of Assignor's Interest
Recorded: 1998-11-20
Pages: 2
Assignor
LEE, JU-HWA
Executed: 1998-10-20
Assignee
LG SEMICON CO., LTD.
1, HYANGJEONG-DONG, HEUNGDUK-KU, CHEONGJU-SI, CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF
Covered Property
(1)
A Method of Fabricating a Semiconductor Package
Patent:
6,146,918 →
Application:
09/195,996 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.