Assignment of Assignor's Interest

Recorded: 1999-02-09 Pages: 2

Assignor

OH, SUNG HO

Executed: 1999-01-05

Assignee

LG SEMICON CO., LTD

CHEONGJU, 1, HYANGJEONG-DONG, HUNGDUK-GU, CHOONGCHEONGBUK-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF

Covered Property (1)

Ball Grid Array Semiconductor Package and Method of Fabricating the Same

Patent: 6,191,370 →

Application: 09/246,948 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.