Patent Assignment
Reel/Frame 009811/0626
Assignment of Assignor's Interest
Recorded: 1999-02-23
Pages: 2
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device with Layered Interconnect Structure
Patent:
6,989,599 →
Application:
09/255,856 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.