Patent Assignment
Reel/Frame 009995/0556
Assignment of Assignor's Interest
Recorded: 1999-06-02
Pages: 3
Assignee
MATSUSHITA ELECTRONICS CORPORATION
1-1, SAIWAI-CHO, TAKATSUKI-SHI, OSAKA, JAPAN
Covered Property
(1)
Polishing Pad for Semiconductor Wafer and Method for Polishing Semiconductor Wafer
Patent:
6,099,390 →
Application:
09/285,647 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.