Patent Assignment
Reel/Frame 010074/0977
Assignment of Assignor's Interest
Recorded: 1999-07-06
Pages: 2
Assignor
GALL, PETER J.
Executed: 1999-06-23
Assignee
VERIDICOM, INC.
2338 WALSH AVENUE, SANTA CLARA, CALIFORNIA, 95051
Covered Property
(1)
Method of Fabricating Integrated Circuit Package with Opening Allowing Access to Die
Patent:
6,331,452 →
Application:
09/290,456 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Apr 26, 2000
From: VERIDICOM, INC.
To: TRANSAMERICA BUSINESS CREDIT CORPORATION
Reel/Frame 010739/0835 →
Release of Security Interest
Oct 30, 2008
From: GE TECHNOLOGY FINANCE CORPORATION SUCCESSOR-IN-INTEREST TO TRANSAMERICA BUSINESS CREDIT CORPORATION
To: VERIDICOM, INC
Reel/Frame 021785/0896 →
Assignment of Assignor's Interest
Jul 17, 2009
From: VERIDICOM, INC.
To: VERIDICOM INTERNATIONAL, INC.
Reel/Frame 022960/0790 →
Assignment of Assignor's Interest
Jul 17, 2009
From: VERIDICOM INTERNATIONAL INC.
To: AUTHENTEC, INC.
Reel/Frame 022960/0876 →
Assignment of Assignor's Interest
Apr 30, 2015
From: AUTHENTEC, INC.
To: APPLE INC.
Reel/Frame 035552/0286 →