Patent Assignment
Reel/Frame 010218/0418
Assignment of Assignor's Interest
Recorded: 1999-09-01
Pages: 4
Assignor
KWON, YOUNG I.
Executed: 1999-08-30
Assignee
S3 INCORPORATED, A CORP. OF DE.
2841 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multichip Module Packaging Process for Known Good Die Burn-In
Patent:
6,251,695 →
Application:
09/388,997 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.