Patent Assignment
Reel/Frame 010729/0308
Assignment of Assignor's Interest
Recorded: 2000-04-13
Pages: 2
Assignor
OHTA, TOSHIYUKI
Executed: 2000-04-07
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Abrasion method of semiconductor device
Patent:
6,361,406 →
Application:
09/549,426 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.