Patent Assignment
Reel/Frame 011192/0754
Assignment of Assignor's Interest
Recorded: 2000-10-04
Pages: 2
Assignor
HONDA, HIROKAZU
Executed: 2000-10-02
Assignee
NEC CORPORATION
MINATO-KU, 7-1, SHIBA 5-CHOME, TOKYO, JAPAN
Covered Property
(1)
Multilayer Interconnection Board, Semiconductor Device Having the Same, and Method of Forming the Same as Well as Method of Mounting the Semiconductor Chip on the Interconnection Board
Patent:
7,217,999 →
Application:
09/678,609 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.