Patent Assignment
Reel/Frame 011324/0018
Assignment of Assignor's Interest
Recorded: 2000-11-22
Pages: 2
Assignors
JEUN, GI-YOUNG
Executed: 2000-09-29
JEUN, O-SEOB
Executed: 2000-09-29
LEE, EUN-HO
Executed: 2000-09-29
LIM, SEUNG-WON
Executed: 2000-09-29
Assignee
FAIRCHILD KOREA SEMICONDUCTOR LTD., A CORPORATION ORGANIZED UNDER THE LAWS OF THE REPUBLIC OF KOREA
82-3, DODANG-DONG WONMI-KU, BUCHEON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Power Module Having an Electrically Insulating Heat Sink and Method of Manufacturing the Same
Patent:
7,449,774 →
Application:
09/677,558 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0460 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0460
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064075/0001 →