Patent Assignment
Reel/Frame 011451/0118
Assignment of Assignor's Interest
Recorded: 2001-01-09
Received: 2001-01-26
Pages: 2
Assignor
COMBS, EDWARD G.
Executed: 2000-12-28
Assignee
ASAT, LIMITED
QPL INDUSTRIAL BUILDING, 138 TEXACO ROAD, TSUEN WAN, NT, HKX, HONG KONG
Covered Properties
(2)
Molded Plastic Package with Heat Sink and Enhanced Electrical Performance
Application:
09/757,729 →
Semiconductor memory device with readily changeable memory capacity
Application:
09/754,121 →