Patent Assignment
Reel/Frame 011460/0190
Assignment of Assignor's Interest
Recorded: 2001-01-10
Received: 2001-01-30
Pages: 2
Assignors
FUJIWARA, NOBUO
Executed: 2000-11-20
HORI, KATSUNOBU
Executed: 2000-11-20
WATADANI, TAKASHI
Executed: 2000-11-27
NAGANO, MAKOTO
Executed: 2000-12-02
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
Covered Property
(1)
Semiconductor Device Having a Layered Wiring Structure with Hard Mask Covering
Application:
09/756,846 →