Patent Assignment
Reel/Frame 011463/0717
Assignment of Assignor's Interest
Recorded: 2001-01-17
Received: 2001-01-30
Pages: 4
Assignor
HOASHI, MASAHARU
Executed: 2000-12-13
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
MITSUBISHI ELECTRIC ENGINEERING COMPANY LIMITED
6-2, OOTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, 100-0004, JPX, JAPAN
Covered Property
(1)
Semiconductor Device with Extra Control Wiring for Improving Breakdown Voltage.
Application:
09/760,800 →