IP Library Assignment 011471/0987
Patent Assignment
Reel/Frame 011471/0987

Assignment of Assignor's Interest

Recorded: 2001-01-26 Pages: 3
Assignor
ULCEJ, JOHN A.
Executed: 2000-01-14
Assignee
EXTRUSION DIES, INC., A DELAWARE CORPORATION
911 KURTH ROAD, CHIPPEWA FALLS, WISCONSIN, 54729
Covered Property (1)
Extrusion Die Membrane Assembly
Patent: 6,352,424 →
Application: 09/475,470 →
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest Jun 12, 2000
From: EXTRUSION DIES, INC.
To: U.S. BANK NATIONAL ASSOCIATION
Reel/Frame 010892/0516 →
Assignment of Assignor's Interest Dec 23, 2002
From: EXTRUSION DIES, INC.
To: EXTRUSION DIES INDUSTRIES, LLC
Reel/Frame 013608/0567 →
Collateral Assignment Dec 23, 2002
From: EXTRUSION DIES INDUSTRIES, LLC
To: U.S. BANK NATIONAL ASSOCIATION
Reel/Frame 013608/0599 →
Security Agreement Oct 29, 2008
From: EXTRUSION DIES INDUSTRIES, LLC
To: HARRIS, N.A.
Reel/Frame 021754/0083 →
Release of Security Interest Dec 8, 2008
From: U.S. BANK NATIONAL ASSOCIATION
To: EXTRUSION DIES, INC.
Reel/Frame 021936/0344 →