Patent Assignment
Reel/Frame 011489/0143
Assignment of Assignor's Interest
Recorded: 2001-01-30
Received: 2001-02-08
Pages: 2
Assignor
HAMADA, KOJI
Executed: 2000-12-18
Assignee
NEC CORPORATION
7-1 SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Device with Interlayer Film Comprising a Diffusion Prevention Layer to Keep Metal Impurities from Invading the Underlying Semiconductor Substrate
Application:
09/771,586 →