Patent Assignment
Reel/Frame 011492/0298
Assignment of Assignor's Interest
Recorded: 2001-01-16
Received: 2001-02-09
Pages: 3
Assignor
LIN, MOU-SHIUNG
Executed: 2001-01-08
Assignee
MEGIC CORPORATION
SCIENCE BASED INDUSTRIAL PARK, 21 R&D FIRST ROAD, HSIN-CHU, TWX, TAIWAN
Covered Property
(1)
Reliable Metal Bumps on Top of I/O Pads with Test Probe Marks
Application:
09/760,909 →