Patent Assignment
Reel/Frame 011492/0553
Assignment of Assignor's Interest
Recorded: 2001-01-17
Received: 2001-02-09
Pages: 3
Assignors
BONITZ, BARRY A.
Executed: 2001-01-03
JOHNSON, ERIC A.
Executed: 2001-01-03
GAYNES, MICHAEL A.
Executed: 2001-01-04
DUCHESNE, ERIC
Executed: 2001-01-10
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NY, 10504, UNITED STATES
Covered Properties
(2)
Adjusting Fillet Geometry to Couple a Heat Spreader to a Chip Carrier
Application:
09/764,048 →
Semiconductor Tiling Structure and Method of Formation
Application:
09/761,885 →