Assignment of Assignor's Interest

Recorded: 2001-01-22 Received: 2001-02-27 Pages: 5

Assignors

LING, JAMIN

Executed: 2001-01-17

STEPNIAK, DAVE CHARLES

Executed: 2001-01-17

Assignee

FLIP CHIP TECHNOLOGIES, L.L.C.

3701 EAST UNIVERSITY DRIVE, PHOENIX, AZ, 85034, UNITED STATES

Covered Property (1)

Electroless Ni/Pd/Au Metallization Structure for Copper Interconnect Substrate and Method Therefor

Application: 09/766,798 →