Patent Assignment
Reel/Frame 011542/0449
Assignment of Assignor's Interest
Recorded: 2001-02-09
Received: 2001-03-05
Pages: 2
Assignor
KAWASHIMA, TOMOHIRO
Executed: 2001-02-05
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Flip- Chip Semiconductor Device and Method of Forming the Same
Application:
09/779,627 →