Patent Assignment
Reel/Frame 011559/0976
Assignment of Assignor's Interest
Recorded: 2001-02-21
Received: 2001-03-12
Pages: 3
Assignor
HONDA, HIROKAZU
Executed: 2001-02-15
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Flip-Chip Type Semiconductor Device and Method of Manufacturing the Same
Application:
09/789,864 →