Patent Assignment
Reel/Frame 011572/0923
Assignment of Assignor's Interest
Recorded: 2001-02-15
Received: 2001-03-14
Pages: 3
Assignors
HUANG, CHING-CHENG
Executed: 2001-01-21
LEI, MING-TA
Executed: 2001-01-21
LIN, CHUEN-JYE
Executed: 2001-01-21
LIN, MOU-SHIUNG
Executed: 2001-01-21
Assignee
MEGIC CORPORATION
SCIENCE-BASED INDUSTRIAL PARK, 21 R & D FIRST ROAD, HSIN-CHU, TWX, R.O.C, TAIWAN
Covered Property
(1)
Reliable Metal Bumps on Top of I/O Pads After Removal of Test Probe Marks
Application:
09/783,384 →