Patent Assignment
Reel/Frame 011578/0923
Assignment of Assignor's Interest
Recorded: 2001-02-13
Received: 2001-03-15
Pages: 2
Assignors
BANDO, KOJI
Executed: 2000-12-13
KONDO, TAKASHI
Executed: 2000-12-13
NARUTAKI, KAZUKO
Executed: 2000-12-13
SHIBATA, JUN
Executed: 2000-12-13
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
Covered Property
(1)
Resin-Sealed Chip Stack Type Semiconductor Device
Application:
09/781,237 →