Assignment of Assignor's Interest

Recorded: 2001-03-07 Received: 2001-03-21 Pages: 5

Assignors

CHAI, SUCHET P.

Executed: 2001-03-01

CHEN, TONG

Executed: 2001-03-01

Assignee

TELEDYNE TECHNOLOGIES, INC.

2049 CENTURY PARK EAST, LOS ANGELES, CA, 90067, UNITED STATES

Covered Property (1)

Method of Packaging a Device with a Lead Frame, and an Apparatus Formed Therefrom

Application: 09/801,339 →