Patent Assignment
Reel/Frame 011592/0633
Assignment of Assignor's Interest
Recorded: 2001-03-09
Received: 2001-03-21
Pages: 2
Assignor
HONDA, HIROKAZU
Executed: 2001-03-05
Assignee
NEC CORPORATION
MINATO-KU, 7-1, SHIBA 5-CHOME, TOKYO, JPX, JAPAN
Covered Property
(1)
Flip Chip Type Semiconductor Device and Method for Manufacturing the Same
Application:
09/801,901 →