Patent Assignment
Reel/Frame 011592/0673
Assignment of Assignor's Interest
Recorded: 2001-03-08
Received: 2001-03-21
Pages: 2
Assignors
IWASAKI, TOMIO
Executed: 2001-01-11
MORIYA, HIROSHI
Executed: 2001-01-11
OHTA, HIROYUKI
Executed: 2001-01-11
IIJIMA, SHINPEI
Executed: 2001-01-16
Assignee
HITACHI, LTD.
6, KANDA SURUGADIA 4-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Device with Adhesion-Improvement Capacitor and Process for Producing the Device
Application:
09/800,493 →