Assignment of Assignor's Interest

Recorded: 2001-03-05 Received: 2001-03-26 Pages: 3

Assignors

HUANG, CHING-CHENG

Executed: 2001-01-28

LEE, JIN-YUAN

Executed: 2001-01-28

LIN, MOU-SHIUNG

Executed: 2001-01-28

Assignee

MEGIC CORPORATION

SCIENCE-BASED INDUSTRIAL PARK, 21, R & D FIRST ROAD, HSIN-CHU, TWX, R.O.C, TAIWAN

Covered Property (1)

Low Fabrication Cost, Fine Pitch and High Reliability Solder Bump

Application: 09/798,654 →