IP Library Assignment 011636/0422
Patent Assignment
Reel/Frame 011636/0422

Assignment of Assignor's Interest

Recorded: 2001-03-19 Pages: 2
Assignors
SHIVKUMAR, BHARAT
Executed: 2001-03-16
CHEAH, CHUAN
Executed: 2001-03-16
Assignee
INTERNATIONAL RECTIFIER CORPORATION
233 KANSAS STREET, EL SEGUNDO, CALIFORNIA, 90245
Covered Property (1)
Semiconductor Multichip Module Package with Improved Thermal Performance; Reduced Size and Improved Moisture Resistance
Patent: 6,949,822 →
Application: 09/812,027 →
Publication: US 2001/0050441
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Jul 23, 2018
From: INTERNATIONAL RECTIFIER CORPORATION
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 046612/0968 →