Patent Assignment
Reel/Frame 011636/0691
Assignment of Assignor's Interest
Recorded: 2001-03-23
Received: 2001-04-04
Pages: 4
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
CHIYODA-KU, 2-3 MARUNOUCHI 2-CHOME, TOKYO, JPX, 100-8, JAPAN
Covered Properties
(2)
Method of manufacture of a solid state image pickup device, and a flexible printed wiring board
Application:
09/814,825 →
Distributed Processing System
Application:
09/815,056 →