Patent Assignment
Reel/Frame 011637/0896
Assignment of Assignor's Interest
Recorded: 2001-03-19
Pages: 2
Assignors
DE LEEUW, DAGOBERT MICHEL
Executed: 2000-11-27
GELINCK, GERWIN HERMANUS
Executed: 2000-11-28
MATTERS, MARCO
Executed: 2000-12-04
Assignee
U.S. PHILIPS CORPORATION
1251 AVENUE OF THE AMERICAS, NEW YORK, NEW YORK, 10020
Covered Property
(1)
Method of Producing Vertical Interconnects Between Thin Film Microelectronic Devices and Products Comprising Such Vertical Interconnects
Patent:
6,635,406 →
Application:
09/704,519 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 25, 2003
From: U.S. PHILIPS CORPORATION
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 014422/0965 →
Assignment of Assignor's Interest
Jul 28, 2011
From: POLYMER VISION LIMITED
To: CREATOR TECHNOLOGY B.V.
Reel/Frame 026666/0854 →
Assignment of Assignor's Interest
Jul 28, 2011
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: POLYMER VISION LIMITED
Reel/Frame 026667/0219 →
Assignment of Assignor's Interest
Mar 22, 2016
From: CREATOR TECHNOLOGY B.V.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 038214/0991 →