IP Library Assignment 011664/0370
Patent Assignment
Reel/Frame 011664/0370

Assignment of Assignor's Interest

Recorded: 2001-03-19 Pages: 2
Assignors
ABADEER, WADGI W.
Executed: 2001-03-19
MOTSIFF, WILLIAM T.
Executed: 2001-03-19
NOWAK, EDWARD J.
Executed: 2001-03-19
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property (1)
Wafer Level System for Producing Burn-in/Screen, and Reliability Evaluations to Be Performed on All Chips Simultaneously Without Any Wafer Contacting
Patent: 6,844,747 →
Application: 09/811,915 →
Publication: US 2002/0132378