Patent Assignment
Reel/Frame 011666/0238
Assignment of Assignor's Interest
Recorded: 2001-03-29
Received: 2001-04-16
Pages: 5
Assignee
CLARISAY, INCORPORATED, A CORPORATION OF DELAWARE
2626 HOWELL STREET, SUITE 840, DALLAS, TX, 75204, UNITED STATES
Covered Properties
(2)
Wafer-Scale Package for Surface Acoustic Wave Circuit and Method of Manufacturing the Same
Application:
09/821,592 →
System and Method for Reducing Power Consumption in a Universal Serial Bus Device
Application:
09/821,006 →