Patent Assignment
Reel/Frame 011683/0864
Assignment of Assignor's Interest
Recorded: 2001-04-02
Received: 2001-04-19
Pages: 2
Assignors
IWASAKI, TOMIO
Executed: 2001-02-27
NAKAJIMA, TAKASHI
Executed: 2001-02-27
OHTA, HIROYUKI
Executed: 2001-02-27
MIURA, HIDEO
Executed: 2001-02-28
SUZUKI, MASAYUKI
Executed: 2001-03-06
YAMADA, KENTARO
Executed: 2001-03-12
NISHIHARA, SHINJI
Executed: 2001-03-13
SAHARA, MASASHI
Executed: 2001-03-13
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Device with Improved Arrangements to Avoid Breakage of Tungsten Interconnector
Application:
09/822,489 →