Patent Assignment
Reel/Frame 011685/0645
Assignment of Assignor's Interest
Recorded: 2001-04-05
Received: 2001-04-20
Pages: 4
Assignor
ISAAK, HARLAN R.
Executed: 2001-04-02
Assignee
DENSE-PAC MICROSYSTEMS, INC.
7321 LINCOLN WAY, GARDEN GROVE, CA, 92841, UNITED STATES
Covered Properties
(2)
Three-Dimensional Memory Stacking Using Anisotropic Epoxy Interconnections
Application:
09/826,621 →
Methods and Devices to Control Polymerization
Application:
09/818,919 →