Patent Assignment
Reel/Frame 011695/0583
Assignment of Assignor's Interest
Recorded: 2001-04-10
Pages: 2
Assignors
KONDO, SEIICHI
Executed: 2001-03-21
SAKUMA, NORIYUKI
Executed: 2001-03-29
HOMMA, YOSHIO
Executed: 2001-03-30
Assignee
HITACHI LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Methods of Polishing, Interconnect-Fabrication, and Producing Semiconductor Devices