Patent Assignment
Reel/Frame 011727/0792
Assignment of Assignor's Interest
Recorded: 2001-04-20
Received: 2001-04-30
Pages: 3
Assignors
MATSUO, ITARU
Executed: 2001-03-30
MIYAMURA, KAYO
Executed: 2001-03-30
RYU, HIROSHI
Executed: 2001-03-30
Assignees
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO, JPX, 100-8, JAPAN
RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORPORATION
4-1, MIZUHARU, ITAMI-SHI, HYOGO, JPX, 664-0, JAPAN
Covered Property
(1)
Method of Manufacturing a Substrate with Directionally Anisotropic Warping
Application:
09/838,388 →