Patent Assignment
Reel/Frame 011729/0230
Assignment of Assignor's Interest
Recorded: 2001-04-26
Pages: 2
Assignors
LEE, SE-MIN
Executed: 2001-04-20
KIM, DONG-HWAN
Executed: 2001-04-20
LEE, KEUN-IL
Executed: 2001-04-20
Assignee
HYUNDAI ELECTRONICS INDUSTRIES CO., LTD.
SAN 136-1 AMI-RI, BUBAL-EUB, KYOUNGKI-DO, ICHON-SHI, 467-8, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Memory Device Using Hemispherical Grain Silicon for Bottom Electrodes
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 23, 2013
From: SK HYNIX INC.
To: INTELLECTUAL DISCOVERY CO. LTD.
Reel/Frame 030471/0480 →
Change of Name
May 23, 2013
From: HYUNDAI ELECTRONICS INDUSTRIES CO., LTD
To: HYNIX SEMICONDUCTOR INC.
Reel/Frame 030490/0238 →
Change of Name and Address
May 23, 2013
From: HYNIX SEMICONDUCTOR INC.
To: SK HYNIX INC.
Reel/Frame 030490/0258 →