Assignment of Assignor's Interest

Recorded: 2001-04-18 Received: 2001-05-02 Pages: 3

Assignors

LEI, MING TA

Executed: 2001-04-09

LIN, CHUEN JYE

Executed: 2001-04-09

LIN, MOU SHIUNG

Executed: 2001-04-09

Assignee

MEGIC CORP.

SCIENCE BASED INDUSTRIAL PARK, 21 R & D FIRST ROAD, HSIN-CHU, TWX, R.O.C, TAIWAN

Covered Properties (2)

Structure and manufacturing method of a chip scale package

Application: 09/837,007 →

Baud-Rate Timing Recovery

Application: 09/759,624 →