Patent Assignment
Reel/Frame 011757/0871
Assignment of Assignor's Interest
Recorded: 2001-05-01
Received: 2001-05-08
Pages: 3
Assignor
ITO, SHINYA
Executed: 2001-04-25
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JPX, JAPAN
Covered Properties
(2)
Method for Fabrication Semiconductor Device Having Trench Isolation Structure
Application:
09/845,306 →
Method and Structure for Automatic Scsi Command Delivery Using the Packetized Scsi Protocol
Application:
09/842,750 →